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Work Experience: Instructor/Lecturer, Department of Chemical Engineering, MTU Lecturer, Department of Engineering Fundamentals, MTU Department Committees: Outreach Publications: Torrey, K., W. Yrjana, and J. King. Effect of Thermally Conductive Fillers on the Internal Bond Strength of Waferboard. Forest Prod. J., Nov/Dec 2003. Hein, G., K. Torrey, J. Hertel, D. Oppliger, J. Keith, and G. Archer. Integrating Engineering Disciplines into a Common First Year Engineering Program. ASEE Conference Proceedings, June 2003. Torrey, K. Influence of Thermally Conductive Fillers on the Physical Properties of Waferboard. M.S. Thesis, Advisor Dr. Julie King, Michigan Technological University, Dec 2001. |
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This page was last updated on 05/29/2007 02:08:43 PM |
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